Report: TSMC Could Double CoWoS Capacity by 2028

TSMC could double its chip-on-wafer-on-substrate (CoWoS) capacity from 2026 levels by 2028, according to a report from Taiwanese media.

CoWoS is TSMC’s leading packaging technology for AI GPUs and is used by major companies such as NVIDIA. The reported expansion comes as existing capacity constraints continue to affect the wider semiconductor industry.

The shortage has reportedly spilled over to other suppliers, including Taiwan’s UMC and Amkor. The report indicates that demand for CoWoS packaging remains strong as companies expand their AI hardware production.

Intel is expected to reach up to 45,000 wafers per month of equivalent CoWoS capacity in 2028, the report says. That figure refers to equivalent packaging capacity rather than TSMC’s own production.

The report does not provide a confirmed TSMC production schedule or explain how the company would achieve the potential increase. It instead describes a possible capacity expansion against the baseline established in 2026, while highlighting the pressure that AI-related demand is placing on advanced chip packaging.