Huawei Says Early 2027 Kirin Results Meet Targets With LogicFolding

Huawei’s LogicFolding architecture has reportedly exceeded expectations, with early test results for a Kirin system-on-chip planned for 2027 meeting the company’s targets, according to Wccftech.

The report says Huawei turned to methods such as improved packaging after lacking access to specialized extreme ultraviolet (EUV) machinery used in advanced chip manufacturing. That limited its ability to compete by adopting newer manufacturing processes.

Huawei announced LogicFolding in May, according to the source. The report does not specify the test results, the targets, or which Kirin chip was tested.

Wccftech also says Huawei has shipped 100 million Kirin chipsets since 2023. Its summary mentions the Kirin 9000S but provides no further details about that chipset.