Report: SK hynix Discusses iHBM Production With Partners, Targeting 30% Better Heat Resistance

SK hynix is reportedly discussing production plans for its next-generation high-bandwidth memory, called iHBM, with supply chain partners. The discussions concern plans for mass production, according to a report by Wccftech.

Conventional HBM stacks layers of DRAM on top of one another and a base die. This arrangement can make heat dissipation difficult because cooling hardware, such as a heat sink or liquid cooler, sits above the stack.

For iHBM, SK hynix has integrated cooling elements directly into the HBM package, according to the report. The design aims to improve heat resistance by 30%. The report does not specify a production timeline or provide further details about the cooling elements.