Huawei roadmap lists Ascend 960 chips for 2027, 288 GB for 2028 and 384 GB for 2029

Huawei has brought forward its artificial intelligence infrastructure roadmap, according to a report by Wccftech. The company disclosed updated Ascend and Atlas roadmaps at Huawei Connect 2026.

The roadmap includes four upcoming accelerators: Ascend 960DT, Ascend 960PR, Ascend 970 and Ascend 980. Wccftech describes the Ascend 960 chips as delivering a major inference boost, but the report does not provide a numerical performance figure.

According to the report, Ascend 960DT and Ascend 960PR are scheduled for 2027. The roadmap then places Ascend 970 in 2028, with a memory capacity of 288 GB.

Ascend 980 is listed for 2029 and is expected to raise memory capacity to 384 GB. The report presents these products as part of Huawei’s next-generation Ascend chip and SuperPod roadmap.

The schedule is described as arriving earlier than anticipated and as Huawei’s response to growing industry demand for artificial intelligence infrastructure. The source does not provide further specifications, release dates, pricing or independent performance testing for the listed accelerators.