Intel manufacturing executive Chris Auth said the company is “only a few percent” behind TSMC on performance, while catching up in scale will take longer. The remarks were reported by Wccftech.
Auth, Intel’s vice president and general manager for manufacturing development and customer engagement, made the comments on the Dwarkesh podcast. He argued that Intel is better suited than TSMC to use High NA EUV lithography machines.
Auth said Intel’s use of backside power delivery lets it print circuits directly with High NA EUV. The source does not provide further technical detail or quantify the performance gap.
Intel chief technology officer Pushkar Ranade also appeared on the podcast. According to the report, Ranade said catching up with TSMC was a matter of scale rather than technology. The account does not give a timetable for closing that gap.
Comments
0No comments yet. Be the first to comment.