Huawei Says LogicFolding Cuts Clock Buffers by 50%, but Heat Limits Remain

Huawei says its LogicFolding technology cuts the number of clock buffers by 50%, but a semiconductor expert cited by Wccftech warns that the heat problem remains.

According to Wccftech, LogicFolding also constrains clock speeds and requires active cooling. Those thermal demands may make the technology less attractive to Qualcomm and Apple, which continue to pursue process miniaturization for their mobile system-on-chips, the report says.

The report links LogicFolding to the constraints Huawei faces under sanctions and describes it as an innovative approach. It also says Kurnal Insights has published die shots of Huawei’s Kirin 9050 Pro, showing a compute die. The available source does not provide further detail about those images or the expert’s identity.

Wccftech frames the remaining thermal issue as a reason Qualcomm and Apple are not interested in the technology. The report does not include comments from either company confirming that position.