Huawei is moving the launch of its next-generation Ascend 960DT AI chip to Q1 2027, the company said Thursday at its Huawei Connect conference. A Huawei spokesperson told TechCrunch that the chip had previously been planned for Q3 2027.
The spokesperson said Ascend 960 chips are launching ahead of schedule, with performance doubling year by year. David Wang, Huawei’s rotating and acting chairman, announced the updated timeline.
Huawei is also developing large AI systems that connect hundreds of thousands, and eventually millions, of chips. Its Peerium Computing Architecture uses UnifiedBus to link processors with memory, storage, and networking hardware. Huawei says its Atlas 950 SuperPoD and SuperCluster are the first systems based on the architecture, and that an Atlas 950 SuperCluster can connect up to 256,000 accelerator cards.
The accelerated chip timeline has raised questions about the broader systems. China tech analyst Rui Ma said Huawei had previously described an Atlas 960 SuperPoD scaling to 15,488 Ascend 960 chips, while the latest announcement referred to a system with 4,096 chips. Huawei continues to pursue its chip ambitions despite U.S. restrictions on China’s access to advanced semiconductor technology.
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