Intel has shown a liquid-cooled OAM card carrying two Crescent Island GPU packages, according to Wccftech. The design is among newly revealed OAM configurations for Intel’s D-Series GPUs.
The report says Intel presented updates on social media and at OCP 2026, a few days after the Crescent Island family was unveiled. It also describes first die shots of Xe3P GPUs in single- and dual-package configurations.
Intel’s D-Series GPUs, previously known as Crescent Island, are based on the Xe3P architecture, the report says. Its headline compares a Xe3P die with “Big Battlemage,” saying the chip is smaller, but provides no dimensions or detailed comparison in the supplied material.
The supplied summary also says the D-Series GPUs will pack up to 512 GB of memory. It does not provide further specifications for the liquid-cooled card or confirm when the products will be available.
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