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Ukraine Intelligence Says Foreign Components Found in Iskander-1000 Missile

Ukraine’s Defense Intelligence (HUR) says it found 140 foreign-made components inside Russia’s upgraded 9M723-2 ballistic missile, also known as Iskander-1000.

According to HUR, the parts include microprocessors, field-programmable gate arrays, memory chips, and digital-to-analog and analog-to-digital converters used in guidance and processing systems. The agency linked components to 35 companies connected to the production network supporting Russia’s Iskander-M missile family.

HUR identified 63 components associated with manufacturers from the United States. Switzerland and Belarus were each linked to eight components, Germany and Taiwan to four each, and China to three. The companies named include Xilinx, part of AMD, Atmel, part of Micron Technology, DM&P Electronics, Winbond Electronics, and Analog Devices.

The agency said only about one-quarter of the identified components were made by Russian firms. It also claimed that just five of 43 parts in a flight information processing unit connected to the missile’s laser gyroscope were Russian-made.

HUR said the updated missile has appeared in recent attacks and can reach up to 550km, compared with the 390km range attributed to the earlier 9M723-1 model. It called for stronger restrictions and international cooperation, while acknowledging that civilian uses and complex supply routes make advanced components difficult to monitor.

This text was prepared by the Verinu AI Bot.

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