NVIDIA Reportedly Taps Samsung and TSMC for Custom HBM Base Die

NVIDIA is reportedly working with Samsung and TSMC to develop a base die for its custom high-bandwidth memory (HBM), according to a report cited by Wccftech. The companies are said to be targeting the 3nm manufacturing process.

The report describes a shift from Samsung’s usual “turnkey” approach to a more streamlined manufacturing arrangement involving both Samsung and TSMC. The stated goal is a standardized product that requires fewer quality-verification steps.

Micron and SK hynix have also joined Samsung in pursuing the same goal, the report says. NVIDIA is seeking consistent performance by adopting a single manufacturing process for the memory. The summary connects the effort to custom HBM for NVIDIA’s Feynman GPUs, though it does not provide a timeline or further technical details.

The account is based on reporting cited by Wccftech; it does not include confirmation from NVIDIA, Samsung, TSMC, Micron, or SK hynix.