Intel CFO David Zinsner said the company’s 14A manufacturing process technology is improving at the fastest pace in its history since the 22-nanometer node launched in 2012.
Zinsner made the remarks at Deutsche Bank’s 2026 Technology Conference, where he discussed progress in 14A’s defect density. Defect density measures the number of flaws or contamination points per unit area of a wafer and is typically reported as defects per centimeter squared.
Intel has also been designing products for the 14A manufacturing technology node. The process is important to the company’s foundry plans, which place Intel’s future in competition with TSMC.
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